| 제품 | 제품소개 | 바로가기 |
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ELECTROLYTIC PLATING THICKNESS MEASURING INSTRUMENT
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목록보기 |
CT-3
ELECTROLYTIC PLATING THICKNESS MEASURING INSTRUMENT
제품 용도
1. For self-quality inspection
2. Non-destructive plating thickness meter measurement value verification and standard plate (sample) fabrication
3. Measurement of plating on metal/non-metal
제품 특징
1. Measure the precise thickness of single-layer, multi-layer, and alloy plating.
2. Not only flat plates, but also circular, thin objects, curved or complex surfaces can be measured.
3. It is measurable for wires such as wires.
제품 사양
| Display | LCD LED, 3 lines |
|---|---|
| Displayed Content | Thickness measurement, automatic decimal point |
| Measuring Range | Minimum: 0.006 µm |
| Maximum: 300 µm | |
| Measurement Principle | Electrolytic (Coulometric) |
| Measurement Unit | µm, nm |
| Minimum Measurable Area | 1.7Ø |
| Special Plating | Black chrome, electroless nickel, Sn-Pb, Zn-Sn, Sn-Cu (alloy layer) |
| Intensity | AUTO 1~5 |
| Measurement Setting for Multilayer Plating | Manual setting |
| Display of Used Electrolyte | Manual setting |
| WT Measurement (WIRE Measurement), Coating, Weight Conversion | Manual calculation |
| Data Storage for Measurement Objects | Not available |
| Statistical Processing | Not available |
| Printing Function | Not available |

